Semiconductor packaging and testing equipment
Semiconductor packaging and testing equipment
Product Information
The STP-180 Taping System is a fully automatic machine especially designed for Thermo-plastic Type Cover Lay Attachment to QFN/DFN Lead Frame.
? UPH >100
? Lead frame size : 60x200-100x300mm
? Tape type : PI 膠帶
? Lamination accuracy : ±0.2mm
? MTBA : 60 min
? MTBF : 168 hrs
? Foot print : H2750 x W1220 x L2575mm
? Net weight : 3200kg
With rich industry knowledge and project practical experience, the company has established a mature project implementation and management methodology system.?
contact us
ADD：BLK 5 Xinhua industry park, No.2 Shuangma St SIP Suzhou China
TEL：+86-512-62870852
EM：sim@simtechco.com?
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