Semiconductor packaging and testing equipment
Semiconductor packaging and testing equipment
Product Information
The ChallenS I ASA System is applied to the bonding process of Unit Lid or Stiffener, using a 4-axis Robot for installation, equipped with pressure detection and vision inspection systems.
? UPH >800
? Mounting accuracy ：+/－0.05 mm
? Supported ：SECS/GEM, CCD
? MTBA：60 min
? MTBF ：168 hrs
? Foot print：H2050 x W1700 x L5200mm
? Net weight：3000kg
With rich industry knowledge and project practical experience, the company has established a mature project implementation and management methodology system.?
contact us
ADD：BLK 5 Xinhua industry park, No.2 Shuangma St SIP Suzhou China
TEL：+86-512-62870852
EM：sim@simtechco.com?
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