Semiconductor packaging and testing equipment
Semiconductor packaging and testing equipment
SFB-150 Inline Flipper System
Release time:2022-04-14
The SFB-150 performs the flipping of FCBGA Package prior to ball mount process.
? UPH ＞150
? Stand along or in-line system to operate
? FCBGA substrate flipping
? AOI inspection available
? CCTV monitoring
? Foot print : H1700 x W1300 x L2150mm
? Net weight : 1400kg
With rich industry knowledge and project practical experience, the company has established a mature project implementation and management methodology system.?
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TEL：+86-512-62870852
EM：sim@simtechco.com?
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