Semiconductor packaging and testing equipment
Semiconductor packaging and testing equipment
Product Information
? UPH >2000
? AOI inspection for wafer surface defective Vision
? Electric resistance testing
? Wafer thickness measurement
? Wafer size : 5/6 inch
? Supported:SECS/GEM
? MTBA : 60 min
? MTBF : 168 hrs
? Foot print : H1700 x W2200 x L8400mm
? Net weight : 6000kg