Semiconductor packaging and testing equipment
Semiconductor packaging and testing equipment
Product Information:
The machine is developped base on the inspection requirements after underfill process.
? Wafer size : 8 inch
? Ceramic porous table
? 6-axis robot arm
? Positioning accuracy : ±0.03mm
? UPH>120K
? Foot print : H1800 x W1750 x L1800mm
? Net weight : 1500kg