Semiconductor packaging and testing equipment
Semiconductor packaging and testing equipment
SLM-700 Laser Mark System
Release time:2022-04-14
Product Information
Use : 2D coding of lead frame before electroplating
Feature : Two loading and unloading methods of material box/stacking system docking and coding information
Parameter : UPH>700
With rich industry knowledge and project practical experience, the company has established a mature project implementation and management methodology system.?
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ADD：BLK 5 Xinhua industry park, No.2 Shuangma St SIP Suzhou China
TEL：+86-512-62870852
EM：sim@simtechco.com?
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